yageo corporation smd inductor / beads multilayer ferrite chip beads ba series [ berd arrary for high density circuit design] 3.20. 2 0.40. 1 1.60. 2 0.90. 2 0.350.15 0.40. 2 0 .80. 1 0.30. 2 shapes and d im ens io ns parts dimensions : 3.20 x 1.60 x 0.90 mm a ppl ic a tio ns ? computers ? lcd monitor ? hard disk drives ? cd-roms ? motherboard f ea t u r es these multi-layered chip bead arrays are surface mounting emi components. four lines in one chip for suppressing noise suitable for high density circuit design. ele ctric al c ha r a ct e ri s tic s pa rt n o. i m pedan c e d c res i s t an c e ra t ed cu rr en t at 100m h z ( ? 25%) ( ? ) max. (m a ) max. bay321609t-300y-s 30 0.4 350 bay321609t-600y-s 60 0.4 250 bay321609t-121y-s 120 0.8 150 bay321609t-241y-s 240 0.8 150 bay321609t-301y-s 300 0.8 150 bay321609t-471y-s 470 1 100 bay321609t-601y-s 600 1.5 100 bay321609t-102y-s 1000 1.7 50 baq321609t-600y-s 60 0.8 150 baq321609t-121y-s 120 0.8 150 BAQ321609T-221Y-S 220 0.8 150 baq321609t-471y-s 470 1 150 baq321609t-601y-s 600 1.5 100 baq321609t-102y-s 1000 1.8 100 ele ctric al c ha r a ct e ri s tic s : l ead- fr ee & r oh s com pl i an c e!! pa rt n o. tes t fr eq i m pedan c e r d c ra t ed cu rr en t ( m h z ) ( ? 25%) ( ? ) max. ( m a ) max. bay321609t-300y-n 100 30 0.4 350 bay321609t-600y-n 100 60 0.4 250 bay321609t-800y-n 100 80 0.8 150 bay321609t-121y-n 100 120 0.8 150 bay321609t-151y-n 100 150 0.8 150 bay321609t-181y-n 100 180 0.8 150 bay321609t-221y-n 100 220 0.8 150 bay321609t-241y-n 100 240 0.8 150 bay321609t-301y-n 100 300 0.8 150 bay321609t-471y-n 100 470 1 100 bay321609t-601y-n 100 600 1.5 100 bay321609t-102y-n 100 1000 1.7 50 p ro du ct i den tific a tio n ba - internal no. tolerance (**) impedance packaging style dimensions design code (*) product symbol bead array * y = general purpose; q = narrow band ** y = 25% yageo will start to release lead-free that meet sony ss-00259 ' s criteria, and internal no. well be changed to "n" as identifcation. ex. sby321609t-300y-n
35 tape ma t e ri al carrier tape : polystyrene for 321609 cover type : polystyene t ape dim ens io ns 40.1 1.940.1 4.00.1 20.05 1.750.1 3.540.1 3.50.05 8.00.2 0.20.05 1.290.05 1.290.05 ty pe b ty pe a ty p ic al ele ctric al c ha r a ct e ri s tic s test instruments : hp4291a impedance / material analyzer dimensions : mm re e l dim ens io ns dimensions : mm re comm ended p a tt e r n 0.6 0.4 2.6 0.8 dimensions : mm p a ck ag i ng quan tity ty pe quan tity /r eel bay321609 3000 baq321609 3000
36 s b/ p b/up/n b /g b / b a se ri es r el i a bi l ity t es t 1-1 m e c han ic al pe rform an c e no. item specification test conditions 1-1-1 flexure strength appearance : no damage test device shall be soldered on the substrate. z change : within 20% substrate dimension : 100 x 40 x 1.6mm rdc : within specifcation defection : 2.0mm keeping time : 30sec. * for 100505, substrate dimension is 100 x 40 x 0.8mm. 1-1-2 vibration test device shall be soldered on the substrate. oscillation frequency : 10 to 55 to 10hz for 1min. amplitude : 1.5mm time : 2hrs. for each axis (x, y & z), total 6hrs. 1-1-3 resistance to appearance : no damage pre-heating : 150oc, 1min. soldering heat solder composition : sn/pb = 63/37 solder temperature : 260 5oc immersion time : 10 1sec. 1-1-4 solderability the electrodes shall be at least 90% covered pre-heating : 150c, 1min. with new solder coating. solder composition : sn/pb = 63/37 solder temperature : 230 5c immersion time : 4 1sec. 1-1-5 terminal strength test 100505 series : 0.2kg test device shall be soldered on the substrate. 160808 series : 0.5kg 201209 series : 1.0kg other series : 2.0kg 1-2 en viro n m en t al pe rform an c e no. item specification test conditions 1-2-1 temperature cycle appearance : no damage one cycle z change : within 20% step temperature (c) time (min.) rdc : within specifcation 1 -55 3 30 2 25 2 3 3 125 3 30 4 25 2 3 total : 100 cycles measured after exposure in the room condition for 24hrs. 1-2-2 humidity resistance temperature : 40 2c relative humidity : 90 ~ 95% time : 1000hrs. measured after exposure in the room condition for 24hrs. 1-2-3 high temperature temperature : 125 3c resistance relative humidity : 0% applied current : rated current time : 1000hrs. measured after exposure in the room condition for 24hrs. 1-2-4 low temperature temperature : -55 3c resistance relative humidity : 0% time : 1000hrs. measured after exposure in the room condition for 24hrs. w
37 mul ti la y e r fe rrit e bead arr a y - b a s e ri es test instruments : hp4291a impedance / material analyzer ba y321609t -300y -s frequency (mhz) rdc<0.4? ra ted cur re nt: 350ma imped ance ( ? ) ba y321609t -600y -s frequency (mhz) rdc<0.4? r ated cur r ent: 250ma imped ance ( ? ) ba y321609t -121y -s frequency (mhz) rdc<0.8? r ated cur re nt: 150ma imped ance ( ? ) ba y321609t -241y -s frequency (mhz) rdc<0.8? ra ted cur re nt: 150ma imped ance ( ? ) ba y321609t -301y -s frequency (mhz) rdc<0.8? r ated cur r ent: 150ma imped ance ( ? ) ba y321609t -471y -s frequency (mhz) rdc<1? r ated cur re nt: 100ma imped ance ( ? ) ba y321609t -601y -s frequency (mhz) rdc<1.5? ra ted cur re nt: 100ma imped ance ( ? ) ba y321609t -102y -s frequency (mhz) rdc<1.7? rated cur r ent: 50ma imped ance ( ? ) baq321609t -600y -s frequency (mhz) rdc<0.40? rated cur r ent: 250ma imped ance ( ? ) baq321609t -102y -s frequency (mhz) rdc<1.80? rated cur r ent: 100ma imped ance ( ? ) baq321609t -601y -s frequency (mhz) rdc<1.50? rated cur re nt: 100ma imped ance ( ? ) baq321609t -221y -s frequency (mhz) rdc<0.80? r ated cur re nt: 150ma imped ance ( ? ) 0 10 20 30 40 50 60 70 80 1 1 0 100 1000 z r x 0 20 40 60 80 100 1 1 0 100 1000 z r x 0 20 40 60 80 100 120 140 160 180 1 1 0 100 1000 z r x 0 50 100 150 200 250 300 1 1 0 100 1000 z r x 0 50 100 150 200 250 300 350 400 450 1 1 0 100 1000 z r x 0 100 200 300 400 500 600 1 1 0 100 1000 z r x 0 100 200 300 400 500 600 700 800 1 1 0 100 1000 z r x 0 200 400 600 800 1000 1200 1 1 0 100 1000 z r x 0 50 100 150 200 250 300 1 1 0 1 00 1000 z x r 0 20 0 40 0 60 0 80 0 1 1 0 1 00 1000 z r x 0 50 0 1000 1500 2000 1 1 0 1 00 1000 z x r 0 500 100 0 150 0 200 0 250 0 1 1 0 100 100 0 z r x 7
38 temperature c for: lead solder for: lead-free solder time:second pre-heating 60 second 120 second 80 second 5~10 second soldering natural cooling 260 c 230 c 160 c 150 c r e comm end s o lde ri ng co nd itio ns for:cl/ clh/ sqv/ smd power inductors/ smd chip beads/ smd filters, transformers, current sensors
|
